回顾蚀刻设备的发展，最早仅是一个蚀刻液槽或缸，存放了蚀刻液，覆铜板挂浸在里面溶液中去除未保护的铜; 后又使蚀刻液搅动或板子摆动，稍微提高蚀刻速度。此后，在蚀刻液槽中间有一根喷管，板子竖直放于槽体周围，喷管旋转的离心力把溶液飞溅于板面上实现蚀刻铜。由于板子固定放置于槽内，人工放板与取板效率低，且劳动强度大。这种条件下加工的板子线条宽度/间距在0.5mm以上。
Reviewing the development of etching equipment, it was only an etching tank or cylinder that stored the etching solution, and the copper clad laminate was hung and immersed in the solution to remove unprotected copper; After that, the etching solution is stirred or the plate is swung to slightly improve the etching speed. After that, there is a nozzle in the middle of the etching liquid tank, and the plate is placed vertically around the tank. The centrifugal force of the nozzle rotation splashes the solution on the plate to realize copper etching. Because the board is fixed in the slot, the manual placing and taking of the board is inefficient and labor-intensive. The width / spacing of board lines processed under this condition is more than 0.5mm.